- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
Patent holdings for IPC class H01L 23/427
Total number of patents in this class: 1717
10-year publication summary
|
103
|
133
|
158
|
182
|
198
|
216
|
131
|
135
|
126
|
55
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 45621 |
79 |
| The Furukawa Electric Co., Ltd. | 3486 |
67 |
| International Business Machines Corporation | 60644 |
55 |
| NEC Corporation | 32703 |
48 |
| Murata Manufacturing Co., Ltd. | 22355 |
45 |
| Microsoft Technology Licensing, LLC | 51439 |
41 |
| Asia Vital Components Co., Ltd. | 413 |
40 |
| Siemens AG | 24990 |
32 |
| Samsung Electronics Co., Ltd. | 131630 |
31 |
| Fujitsu Limited | 19265 |
29 |
| Mitsubishi Electric Corporation | 43934 |
28 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
26 |
| Denso Corporation | 23338 |
25 |
| Toyota Motor Corporation | 28582 |
23 |
| Qualcomm Incorporated | 76576 |
21 |
| Nidec Corporation | 2579 |
20 |
| Dai Nippon Printing Co., Ltd. | 3891 |
19 |
| Raytheon Company | 8535 |
18 |
| Google LLC | 38759 |
17 |
| Shinko Electric Industries Co., Ltd. | 1186 |
16 |
| Other owners | 1037 |